Tektronix Component Solutions: Wire Bonding Services

Wire bonding has proven to be a dominant interconnect technology due to its versatility, performance and reliability. Recent advances in ultra-fine-pitch wire bonding services have allowed for package-size reduction while providing higher interconnect densities. Additionally, wire bonding can be accomplished on a variety of substrates, ranging from PCBs to multi-layer and thick-film ceramics to flexible circuits, offering a dynamic interconnect solution.

Advanced wire bonding services are a core competency at Tektronix Component Solutions. We utilize both gold and aluminum wire bond materials and can support multi-row and high-density interconnect requirements. Additionally, we have well-established capabilities in thermosonic ball-stitch wire bonding, thermocompression ball-stitch wire bonding, thermosonic wedge bonding, ultrasonic wedge bonding and ribbon bonding.

Wire Bonding Process Capabilities:

Ball-stitch bonding (thermosonic and thermocompression):

Process Capabilities	Units	Routine	Special
Wire Diameter	mils	0.8, 1, 1.2	0.7
IC Bond Pad Dimensions	µm	65 x 65	50 x 50
IC Bond Pad Pitch - Inline (min)	µm	80	75
IC Bond Pad Pitch - Staggered (min)	µm	150	125
Wirebond Length (min)	mm	1	0.4
Wirebond Length (max)	mm	3	4

Wedge bonding (thermosonic and ultrasonic)

Process Capabilities	Units	Routine	Special
Wire Diameter	mils	0.8, 1	0.7
Ribbon Width	mils	2-3	8
Bond Finger - Au Plating Thickness (min)	µin	35	75
IC Bond Pad Dimensions (min)	µm	65 x 65	50 x 50
IC Bond Pad Pitch - Inline (min)	µm	100	80
IC Bond Pad Pitch - Staggered (min)	µm	150	125
Wirebond Length (min)	mm	1	0.4
Wirebond Length (max)	mm	3.75	5